• SES-700

    Trans SES-700 is a multipurpose, single component heat curing thixtorpic paste adhesive of high impact strength and toughness, even at subzero temperatures. It is suitable for bonding a wide variety of metals and many other materials.

    Trans SES-700 cures at 150-200°C, heat resistant to 120°C, very good peel strength, good chemical resistance, thixopropic – no flow during cure, gap filling to 3 mm, exceptionally good impact strength at temperatures down to -40°C.

    Trans SES-700 may be stored for upto 3 months at 2°-8°C. The life of product is 3 months at 15-20°C after removal of from storage at 2° – 8° C.